PCB for Computer & Communications

"Mastering data is mastering the future." We focus on IDC: High-speed PCBs for Internet data centers.
￭ Up to 30 layers of vias/press-fit blind holes/back-drilled boards, precise multi-group impedance control.

￭ Super-low loses laminates, copper foil & S/M.

￭ Hybrid laminates for cost down.

￭ Pin laminations press for high layer count.
￭ LDI/DI/AVI.
￭ Plasma for Desmear.
￭ Pulse plating for a high aspect ratio via.
￭ Vacuum etching for fine line.
￭ Controlled impedance.
￭ Controlled Anti-CAF.
￭ CCD back drill machine.
￭ High-density electric testing machine.
￭ Smaller press fit hole size (0.4 mm).
￭ Reliability testing, thermal stress, IST, T-260.
￭ Gold finger and segmented gold finger.

PCB for Server

PCB for Cloud Computing & Big Data

PCB for Industrial Computer

PCB for Cloud Computing & Big Data...

PCB for Graphics Card

PCB for Graphics Card...